WaferChem found in 2015, is a leading professional semiconductor packaging materials company and one of the key material supplier in the semiconductor industry, with sites in Taiwan and USA.

WaferChem provides advanced packaging materials for wafer/panel level packaging and build-up film for ABF substrate. Our customers come from worldwide OSATs, IC substrate foundry in a wide range of industries, such as Automobile, AI, 5G, HPC, Server, etc.

WaferChem offers advanced materials solution to achieve quality excellence, exceed customers’ expectation and earn continuous recognition.

Vision:

WaferChem envisions being a global leader and innovator in semiconductor packaging materials, contributing significantly to the advancement and excellence of the semiconductor industry. We strive to be the preferred partner for customers worldwide, offering cutting-edge solutions that transcend industry expectations.

Mission:

WaferChem is dedicated to providing advanced semiconductor packaging materials, specializing in wafer/panel level packaging and build-up film for ABF substrate. Our mission is to empower our customers, including OSATs and IC substrate foundries across diverse industries such as Automobile, AI, 5G, HPC, Server, etc., with high-quality materials that drive innovation and enhance product performance.

Registered capital:  NTD 205,000,000

Location: Hsinchu Science Park, Chu-nan Base, Taiwan

Fab Space: 2,228 m2

Cleanroom: Class 10,000 & 1,000

Production Capacity:  40,000m2 / Month 

                                         120,000m2/ Month  (2024 Q4)

WaferChem 3A Strategy

-Adjustability – Can customized material features for customer.

-Availability – Short delivery time and sufficient capacity

-Affordability – Local supply with competitive price

WaferChem Location

Find us on 

IG: https://www.instagram.com/waferchem_tech/

Twitter: https://twitter.com/waferchem