Molding Sheet and Film are the molding compound for wafer level package

●100% made in Taiwan, 100% Taiwan design

●Application for WLCSP process

●Easy process

●Excellent insulating reliability.

●Control the warpage of wafer effectively

●Excellent grind ability

●Excellent gap filling, protect device from moisture uptake

●Excellent chemical resistance for RDL process

●Good resin flow to over-mold chip
●Thickness uniformity
●Capable ‘through mold via and SAP to make PoP structure

Application: WLCSP & FC-BGA

Advantages over FC-BGA
●Thinner
●Shorter inter connection due to substrate-less
●Future potential for SiP / 3D integration
●Lower thermal resistance

Advantages over fan-in WLCSP
●No pad pitch restriction due to fan-out area
●Only KGD is packaged!
●Potential SiP integration
●Lower thermal resistance