晶圓翹曲調控膜

Wafer Warpage Control Film

國內首家自主研發晶圓級封裝晶圓翹曲調控膜材

晶片保護及晶圓扇出控制翹曲的最佳方案

Wafer protection and Fan-Out Warpage Control solution

優點:       

●耐高溫 > 300度

●可以調控各種封裝後板翹曲程度, 以利後續RDL製程

●具有rework的特性

●具優異耐化學藥劑特性，可延續RDL製程 

●具良好的研磨特性

●介面接著力強 (Glass wafer也適用)

●低介電常數

●高散熱

●高流動填孔性

●增加晶圓強度

●可客製化開發 (Laser De-bond...等)

●0-5度保存，節能減碳

厚度:

20~200 um

應用: 

●先進封裝製程

●異質整合& 3D IC

●晶圓級封裝/面板級封裝

●先進製程

●共封裝光學CPO   

客戶實績:

●台灣前三大封測廠

●大陸前三大封測廠               

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歡迎致電或來信索取公司產品型錄

#半導體  #封裝  #Fanout

#扇出  #客制化  #翹曲調控膜  #晶化科技

#晶圓保護 #先進封裝 #RDL #台灣研發 #台灣生產 #關鍵材料自主化 #材料供應在地化

#半導體國產化

The data sheet contains measurement values for the product under certain conditions. The values are not guaranteed.・Quality, performance and function differ according to the conditions under which the product is used. For details, contact the department in charge of the product in question.・Results other than the values given here may be obtained depending on how the product is used. Customers should perform their own tests in order to use the product more properly and safely.・The product and product specifications are subject to change without notification.・WaferChem owns the right to any intellectual property contained herein. We ask that you contact the department in charge of the product in question prior to using the products data sheet for any purpose other than the purpose intended.