Wafer Warpage Control Film
Wafer Warpage Control Film
● Independent research and manufacure in Taiwan
● Can control any wafer warpage for RDL process.
● Excellent laser marking quality.
● Excellent adhesion performance with metal and glass .
● Excellent heat
● Application for Infrared (IR) Transmission inspection of wafer backside.
● Can Customize film feature i.e. magnetic, transparent...etc.
● Eco-friendly, do not contain toluene
Product Structure:
Width:
- 220mm for 8” Wafer
- 330mm for 12” Wafer
- 500~680mm for Panel Size
- Customized Size
Thickness:
20 ~ 200 um
Applications:
Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging, Heterogeneous Integration
The data sheet contains measurement values for the product under certain conditions. The values are not guaranteed.・Quality, performance and function differ according to the conditions under which the product is used. For details, contact the department in charge of the product in question.・Results other than the values given here may be obtained depending on how the product is used. Customers should perform their own tests in order to use the product more properly and safely.・The product and product specifications are subject to change without notification.・WaferChem owns the right to any intellectual property contained herein. We ask that you contact the department in charge of the product in question prior to using the products data sheet for any purpose other than the purpose intended.
