Die Attached Film

● Independent research and manufacure in Taiwan. 

● Application for WLCSP & Panel Fan-Out process.

● Excellent adhesion performance with metal and glass.

● Excellent chemical resistance.

● Have outstanding die bond ability

● No die shift   

●Good Stripper Resistance

●Void Free

Application: 

●COC: Chip on Chip

●COW: Chip on Wafer

●COS: Chip on Substrate