Wafer Protection Film

● Independent research and manufacure in Taiwan 

● Application for WLCSP & Fan-Out process, can reduce the defects caused by cutting the wafer.

● Excellent laser marking quality.

● Excellent adhesion performance with metal .

● Excellent heat dissipation.

● Rework ability is better than Japan Brand.

● Application for Infrared (IR) Transmission inspection of wafer backside.

● Control wafer warpage for RDL process.

● Can Customize film feature i.e. magnetic, transparent...etc.

● Eco-friendly, do not contain toluene

● Local supply with competitive price

● Only 2nd source of L brand backside proteciton film

Product Structure:  

Width:

• 220mm for 8” Wafer
• 330mm for 12” Wafer
• 500~680mm for Panel Size
• Customized Size
•          

Thickness:

 20 ~ 200 um

Applications:

SiP, WLP, WLCSP, Flipchip, Stacked die, Fan-out, Fan-in, 3D IC

Product Series:     

Reliability Test: 

The data sheet contains measurement values for the product under certain conditions. The values are not guaranteed.・Quality, performance and function differ according to the conditions under which the product is used. For details, contact the department in charge of the product in question.・Results other than the values given here may be obtained depending on how the product is used. Customers should perform their own tests in order to use the product more properly and safely.・The product and product specifications are subject to change without notification.・WaferChem owns the right to any intellectual property contained herein. We ask that you contact the department in charge of the product in question prior to using the products data sheet for any purpose other than the purpose intended.