Advanced packaging materials has been a focus area of WaferChem Technology for many years. We are the local supplier of advanced packaging technologies with film materials such as wafer protection film, wafer warpage control film, laser de-bond film, Taiwan build-up film…etc. Much of our work in this area takes place at our Advanced Packaging Development Center in Zhunan Science Park, Taiwan. It’s where we work closely with our semiconductor customers to accelerate development of the advanced packaging - heterogeneous integration.

Core Technology
     

Our Team

WaferChem President : Dr. TK Chen

- Master of Chemical Engineering - National Tsing Hua University

- PhD of Material Science– National Yang Ming Chiao Tung University

- 20+ years professional experience in semiconductor industry

• - 40 Employees
• - R&D: 25%
• - PhD + Master degree: 50%
• - Bachelor degree: 40%
• - 8 years professional experience: 50%

Patents

2018.03  -  Semiconductor interface bond solution(I669207) 

2018.12  - Solid compound protective film, invention patent (I637024)

2019.07  - Protective film, invention patent (I690040)

2022.06  - Fan-Out packaging structure (M632394)

2022.08  - Redistribution Layer structure for packaging