Molding Sheet/ Film 系列產品為晶圓封裝材料使用 

●適用於WLCSP製程

●製程簡易

●有效控制晶圓翹曲

●具有良好的研磨特性

●具有優異缺口填補性，有效保護元件不受濕氣傷害

●具有良好的耐化性，可延續RDL製程

Molding Sheet and Film are the molding compound for wafer level package

●Application for WLCSP process

●Easy process

●Excellent insulating reliability.

●Control the warpage of wafer effectively

●Excellent grind ability

●Excellent gap filling, protect device from moisture uptake

●Excellent chemical resistance for RDL process

●Good resin flow to over-mold chip
●Thickness uniformity
●Capable ‘through mold via’ and SAP to make PoP structure

適用領域:

SiP, WLP, WLCSP, Flipchip, Stacked die, Fan-out, Fan-in, SAW, MUF (molding underfill)等先進封裝領域, 共封裝光學CPO   

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