Taiwan Build-Up Film (TBF)
Products
Taiwan Build-Up Film
Taiwan Build-up Film(TBF) is mainly used in ABF substrate, which can replace Ajinomoto build-up Film.
More than 90% of the key materials of ABF substrate - build-up Film depends on imports. As the output value of ABF substrate, Taiwan accounts for 50% of the world and the output is the world NO.1. The risk of key materials being monopolized by large foreign manufacturers is high, it is easy to cause supply chain interruption such as trade policies, natural disasters and geopolitics.
In order to overcome the difficulty that ABF materials are monopolized by Japanese manufacturers and lack of production capacity. WaferChem has devoted all its efforts to R&D advanced semiconductor materials. It is also
the only one who has invested in the build-up film materials for ABF substrate in Taiwan, we hope to promote the localization of Taiwan semiconductor materials supply chain.
Advantages
● Independent research and manufacture in Taiwan
● Copper can chemical plating on the build-Up film which can replace traditional copper foil substrate.
● Can reduce the thickness of substrate, solve the difficulty of laser drilling on BT substrate.
● Excellent adhensive performance, chemical resistance and grinding material.
● Low CTE to reduce package warpage
● Low Dk & Df (Df<0.003 in 10GHZ)
● Long working time (2-3X longer than Japan Brand)
● Lead time short and sufficient capacity
● Local supply with competitive price
●UL94-V0
●Freedom-to-Operate
●No crack in big size of build-up substrate
●TBF-RCC is developing
Product Structure:
Taiwan Build-Up Film Process Flow
Not just me-too
We have better performance
Thickness:
10 ~ 150 um
Monthly Capacity:
Over 200,000 Square Meters
Applications:
IC interlayer dielectric material, coreless substrate, 5G product, ABF substrate, sheet resistance
Package Substrates for CPU, Networking, PCIe Switch devices and more
| TBF-GL | TBF-MR | Other (S) | Other (A) | |
| Thicknesses [μm] | 20-150 | 20-150 | >20 | - |
|---|---|---|---|---|
| CTE (25-150°C) [ppm/°C] | 16 | 20 | 24.5 | 39 |
| CTE (150-240°C) [ppm/°C] | 62 | 42 | 70 | 117 |
| Dk (10GHz) | 3.2 | 3.2 | 3.3(5.8GHz) | 3.2(5.8GHz) |
| Df (10GHz) | 0.003 | 0.013 | 0.009(5.8GHz) | 0.018(5.8GHz) |
| Tensile Strength [MPa] | 40 | 51 | 100 | 98 |
| Young’s Modulus [GPa] | 6.6 | 6.0 | 8.0 | 5.0 |
| Tg (DMA) [°C] | 187 | 190 | 205 | 168 |
| Elongation [%] | 0.8 | 1.4 | 2.4 | 5.6 |
| Flame Retardant (UL94) | V0 | V0 | V0 | V0 |
Reliability Test:
| Test Item | Time Point | Result |
| HTGB | 500/1,000 hrs | Pass |
| HTRB | 500/1,000 hrs | Pass |
| HAST | 96 hrs | Pass |
| H3TRB | 1,000 hrs | Pass |
| Autoclave | 196 hrs | Pass |
Customer Feedback
ABF substrate market information
The data sheet contains measurement values for the product under certain conditions. The values are not guaranteed.・Quality, performance and function differ according to the conditions under which the product is used. For details, contact the department in charge of the product in question.・Results other than the values given here may be obtained depending on how the product is used. Customers should perform their own tests in order to use the product more properly and safely.・The product and product specifications are subject to change without notification.・WaferChem owns the right to any intellectual property contained herein. We ask that you contact the department in charge of the product in question prior to using the products data sheet for any purpose other than the purpose intended.
