Transparent Molding Film

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Transparent Molding Film  

       

● Independent research and manufacure in Taiwan

● Transparent feature let 3D IC packaging stack and align easily.

● Excellent adhensive performance, chemical resistance and grinding material.

● Excellent gap filling ability, protect device from moisture damage.

● Low CTE and no die-shift.

● Low Dk & Df.

● Eco-friendly, do not contain toluene.

   

Product Structure:

    

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Width:

         

  • 220mm for 8” Wafer
  • 330mm for 12” Wafer
  • 500~680mm for Panel Size
  • Customized Size
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Thickness:

 20 ~ 200 um

     

Applications:

Fan-Out, Fan-In, WLCSP, SiP, 3D IC packaging

Mini/Micro LED packaging (Effective protection of LED chip and prevent falling off)

       

    

The data sheet contains measurement values for the product under certain conditions. The values are not guaranteed.・Quality, performance and function differ according to the conditions under which the product is used. For details, contact the department in charge of the product in question.・Results other than the values given here may be obtained depending on how the product is used. Customers should perform their own tests in order to use the product more properly and safely.・The product and product specifications are subject to change without notification.・WaferChem owns the right to any intellectual property contained herein. We ask that you contact the department in charge of the product in question prior to using the products data sheet for any purpose other than the purpose intended.